MCCCL N-Series
MCCCL N-Series
\ Details /
| Product Composition
Nan Pao - N Series
* Base Materials :
Aluminum Plate and its thickness：1052 /5052 Aluminum Alloy，0.8 & 1.5 mm
Adhesive type and its thickness：Modified expoxy resins system，25~120um
Copper Foil Thickness: 1~2 oz
* Product Characteristics :
◎ High Thermal Conductivity
◎ Low Thermal Resistance
◎ Superior Mechnical Operation
◎ Outstanding Electrical Properties
◎ RoHS Compliances
* Product Specification :
| Test Item | NSNI535B1510K | NSNI510C1510M | NSNI535D1010U | Test Method |
| Adhesive type | B | C | D | |
| Aluminum plate Thk. | 1.5㎜ | 1.5㎜ | 1.0㎜ | |
| Adhesive Thickness | 50 μm | 60 μm | 100 μm | |
| Copper Foil Thk. | 35 μm(1OZ) | 35 μm(1OZ) | 35 μm(1OZ) | |
| Anoid Process | YES | YES | YES | |
| Peel Strength | ≧1.5 kgf/cm | ≧1.2 kgf/cm | ≧1.5kgf/cm | IPC TM 650 2.4.9 |
| Thermal Conductivity | ≧18 W/(m∙K) | ≧25 W/(m∙K) | ≧18 W/(m∙K) | ASTM D5470-06 |
| Thermal Resistance | ≦0.9 ℃*cm2/W | ≦0.65 ℃*cm2/W | ≦0.63 ℃*cm2/W | ASTM D5470-06 |
| Dielectric Withstanding Voltage (AC Hi-pot) | 3 KV (60 sec、pass) |
3 KV (60 sec、pass) |
3 KV (60 sec、pass) |
IPC-TM-650 2.5.7 |
| Solder Float | 288℃/ 30 sec PASS | 288℃/ 30 sec PASS | 288℃/ 30 sec PASS | IPC TM 650 2.4.13 |
| Surface Resisivity | ≧ 1.0*1011 Ω | ≧ 1.0*1011 Ω | ≧ 1.0*1011 Ω | IPC TM 650 2.5.17 |
| Volume Resisivity | ≧ 1.0*1013 Ω．㎝ | ≧ 1.0*1013 Ω．㎝ | ≧ 1.0*1013 Ω．㎝ | IPC TM 650 2.5.17 |
| Glass transition temperature(Tg) | 100℃ | 140℃ | 130℃ | TMA |
| Thermal decomposition temperature(5% Td) | 420℃ | 420℃ | 410℃ | TGA |