PI stiffener - NAN PAO TECHNOLOGY CO., LTD.
PI stiffener
PI stiffener
\ Details /

| Product Composition

Nan Pao - T Series

* Base Materials : 
PI composite material thickness:3~9 mil
Adhesive type and its thickness:Modified expoxy resins system,25~37.5um

* Product Characteristics : 
◎File No. E242399 , UL – 94V0 certified
◎ Excellent Peel Strength
◎ Good Thermo-Stability
◎ Good Chemical Resistance


* Product Specification : 
 

Product Number T3A2F1H
PI Composite
Material 75 um
AD 35um
Release Pape
 
T5A2F1H
PI Composite
Material 125 um
AD 35um
Release Pape
 
T6A3F2H
PI Composite
Material 150 um
AD 35um
Release Pape
 
Product Properties Unit
Peel strength (kgf/cm) kgf/cm ≧1.0 ≧1.0 ≧1.0
Solder Float Resistance  300℃×30sec Pass Pass Pass
Resin Flow mm <0.3 <0.3 <0.3
Product Thickness μm 110 160 185
Flammability 94-V0 PASS PASS PASS

 
Product Number T7A3F2H
PI Composite
Material 175 um
AD 35um
Release Pape
 
T8A3F2H
PI Composite
Material 200 um
AD 35um
Release Pape
 
T9A3H2H
PI Composite
Material 225 um
AD 35um
Release Pape
 
Product Properties Unit
Peel strength (kgf/cm) kgf/cm ≧1.0 ≧1.0 ≧1.0
Solder Float Resistance  300℃×30sec Pass Pass Pass
Resin Flow mm <0.3 <0.3 <0.3
Product Thickness μm 210 235 260
Flammability 94-V0 PASS PASS PASS